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IP Insider - Semiconductor IP news and trends blog with John Blyler

IP Insider
Semiconductor IP News and Trends Blog

By John Blyler

Semiconductor Design Vs. the End-User Experience

Is it possible for semiconductor engineers to design directly for the end-user experience? Your comments are needed.

At a recent conference, Cadence’s Frank Schirrmeister noted that EDA companies have had to expand their coverage into the larger system market, thanks to changes in the semiconductor supply chain. Will this expansion ever reach end-product design (i.e., directly to the end user)?

Here’s another way of asking the same question: Will models/simulations/prototypes used by EDA-IP hardware and software engineers ever converge with similar models used by high-level product-development teams and end users?

Companies like Intel, Dassault, Cadence, Synopsys, Mentor, and others have tried to answer this question. Today, hardware customization – including SoCs and FPGAs – is done via software. (Stacked dies may still be the exception.) But something more is needed. How do we, as engineers, participate in designing the end-user experience?

I’d really like to hear your thoughts – especially by the end of this week. Please leave a comment here or send it to me: blyler@chipestimate.com. Thanks – John

How can left-brained (engineer) and right-brained (consumer) people come together to design useful electronic semiconductor products?



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Reversing Moore’s Law; Interface IP; GPUs; Wafers Down

This “week in review” covers Moore’s Law in reverse, Cadence’s interest in interface IP, a game GPU video, wafers’ decline, and the dangers of armchair publishing.

I have several varied bits of news that might enrich your view of our semiconductor world:

* Moore’s Law Predicts Life Originated Billions of Years before Earth – Check out this way-cool thought experiment in which Moore’s Law is projected backwards to predict the theoretic chronological origins of life on Earth. For completeness, perhaps the projection should have been down with Wright’s Law (“Wright’s Law Edges Out Moore’s Law in Predicting Technology Development”).

* Cadence Challenges Synopsys on Interface IP – I’m sure you’ve read this announcement. Cadence is pushing into the interface IP market, offering a direct challenge to the dominant player – Synopsys. I won’t dwell on the business implications of this push, but rather note that it gives further weight to the growing importance of subsystem IP.

* Sean O’kane and I enjoyed a quick video chat with David Harold from Imagination Technologies at the Game Developers’ Conference. Among other things, Harold demonstrated his company’s GPU, which brings PC-quality gaming graphics to a tablet.

John and Sean interview David Harold from Imagination Technologies at the Game Developers’ Conference.

* DAC Commercial 2013 - DAC is just around the corner and at a new location – beautiful Austin, TX.

* Slight Decrease in 1Q2013 Silicon Wafer Shipments – The worldwide silicon wafer area shipments decreased during first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. The report notes that the first quarter is typically weak and that volumes are up relative to the same quarter last year. For the remainder of the year, it is hoped that the silicon industry will follow the projected modest growth in the semiconductor industry.

* Armchair Editors – At first, I was saddened by this article. It seems that everyone is becoming a publisher, further benefiting from the content generated by fewer and fewer real editors. Unfortunately, the original content source is not always cited and no compensation is paid to the original content creators (i.e., the Internet model). Apparently, Flipboard has just launched a new curation resource. Professional curators (another name for editors and writers) might be worried, as this resource encourages armchair publishers to further saturate the market. The end result is that established publishers will have less revenue to pay for original content. However, taken another way, it may mean that “professional curators” (like editors and writers) may further their own brand by using these same armchair-publishing resources.

* Are you looking for a good way to invest 5 minutes of your life? If you are an RF or analog/mixed-signal designer, I humbly suggest that you take a survey on RF chip technology.



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CMMI Past Awakens Semiconductor Reboot

A visit near DoD Mitre territory reinforces the need for hardware and software capability assessment in the semiconductor market.

It was one of those moments when one catches a nearby dinner conversation and immediately has a flashback. For me, that flashback was to the windy desert that surrounds a DOE superfund cleanup site in Hanford, WA.  It was the beginning of the new millennium. I had just helped to develop and implement one of the first Capability Maturity Model – Integration (CMMI) projects.

Let’s return to the present. Last night, I overheard several gentlemen at dinner talking about a CMMI assessment that they were conducting. Considering my location – just outside of Boston and deep in Mitre territory (think big DoD projects) – such conversations must be commonplace.

But CMMI discussions are seldom heard in the west – especially in Silicon Valley. That will change as the semiconductor world becomes more involved with software development (see “Google’s Software Process Challenges Semiconductor IP“).

I recently found another perspective that supports my push for CMMI-type assessments in the semiconductor space. Not surprisingly, this perspective comes from the automotive electronics market (“CMMI in Semiconductor Development”). As the amount of semiconductor-based hardware and software increases in automobile electronics, so will the need for new development and assessment processes.

Combined hardware and software assessments are coming to the semiconductor industry. It’s only a matter of time.



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Long Standards, Twinkie IP, Macro Trends, and Patent Trolls

In Part II, IP Extreme’s Savage reveals why IP standards take so long while discussing brand values, macro trends, and changes wrought by patent trolls.

Blyler: Last time we talked, we covered the ongoing development of a soft IP standard. Should we expect an update in the near future?

Savage: The standard is in draft form and being reviewed among the technical contributors at Accellera. It’s just a matter of getting consensus within the EDA community and with the equipment manufacturers, who will need a mechanism to read the soft IP. What helps a lot is that this standard is based on the existing one for hard IP tagging. There are just a few extra things that needed to be added (to the soft IP standard).

Blyler: Please tell us more about those “extra things.”

Savage: One of the extra things proposed in the soft IP standard is the inclusion of export control information in the tag. That’s important in IP. For example, if the semiconductor IP has an Export Control Classification Number (ECCN), that information could be placed in the tag. It could then be discovered later on an actual device – perhaps in a (geographic) location where it shouldn’t be.

Blyler: Some have complained that the soft IP standard is taking too long to ratify. Any comments?

Savage: Things just move slowly in the semiconductor IP world – especially when you have interoperability with the EDA community. The challenge is that you need a handshake between the IP developers, the EDA companies who create the tools (that will need to make the [soft IP] machine-readable), and finally the semiconductor companies (who will actually be using the tools). You have to get all of those constituencies lined up. Like any standard, it takes a number of years before everyone agrees on the details and then gets the standard into widespread industry use.

Blyler: Has that process been made easier with all of the consolidations taking place in the EDA community? Do things move faster now because there are fewer players?

Savage: Surprisingly, the consolidation probably works against that. The problem is assessing a dollar value gain (to the soft IP). How much more can I charge if I support this standard? If you can’t answer that question, there is not a lot of motivation for EDA companies to invest in these things – especially in comparison to developing features for which people will pay extra money.

Blyler: Any other trends that you see?

Savage: We work with many companies to help create external channels for their internal IP. Lots of semiconductor companies talk with us about how to efficiently manage both their internal and external IP.

There is a nice video that Kevin Kline from Freescale did for us at our recent user event. One of his key points was that the value of the internal IP is worth more than the market cap of the company itself. It is analogous to Hostess Twinkies in that the value of the brand is worth way more than the Hostess factories. It’s similar with IP at large semiconductor companies.

I’ve had analysts call me to ask about the value of a specific company IP portfolio in relation to the competition. It seems that an increasing number of semiconductor companies are taking a more strategic view of their IP – beyond just the raw material and resources point of view. Within the next five years, I think that companies will think completely differently about their IP. This is a big macro trend – a new way of looking at IP.

Blyler: How do companies determine the real marketplace value of their IP? Is there an accepted benchmark or other means of open comparison?

Savage: The situation is very fluid. Look at the activities of Google and Motorola, where companies were being bought just for their IP. But their IP became a lot more valuable once Apple and Google started fighting it out in the marketplace (i.e., iOS vs. Android). A company’s IP may not have much value until something happens in the market. Then it becomes extraordinarily valuable. The big problem facing most companies is that they don’t know what IP they have. They might have this big opportunity because the market shifts and they are suddenly sitting on a treasure trove that they didn’t know they had.

Blyler: What about patent and IP trolls? I’ve seen companies that announced partnerships with certain patent houses and then, a month later, sued a competitor for patent infringement. I’m wondering what effect that has on innovation. Do you think patent trolls slow down innovation in favor of quick financial returns?

Savage: Most people have a pretty negative view of patent trolls – like the modern version of the highwayman. The troll analogy is quite good, as they seem to wait for someone interesting to appear. Then they pop out and ask for “your money or your life.” Inevitably, the industry will be heading for some kind of legislation to put some brakes on that activity – especially since there are a lot of people trying to get rich quick by specifically setting up practices to do patent trolling. It’s an extremely negative thing. But that is another reason why companies need to be on top of what IP they have. In these situations, you might have cross-licensing and such.

Blyler: Thank you.

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Are Designers Really Affected by the Semi Supply Chain?

Do chip designers really need to worry about these external influences? Serus, Dassault Systemes, Mentor Graphics-Valor, and Open Silicon share their insights.

We live in a tumultuous world in terms of disruptive technologies, natural disasters, and global politics. Do chip designers need to worry about such seemingly external influences, as manifested by the global semiconductor manufacturing and supply chain? I asked this question of professionals in the manufacturing-supply-chain, product-lifecycle-management (PLM), board-level-design, and chip-design-services industries, respectively: Geoff Annesley, CTO at Serus; Brian Haacke, High Tech Industry Sales Director, Dassault Systemes; Michael Ford, Marketing Development Manager, Mentor Graphics–Valor; and Naveed Sherwani, President and CEO of Open Silicon. What follows is a portion of their observations. — JB

Blyler: Do chip designers really need to worry about the seemingly external influences of the global semiconductor manufacturing and supply chains?

Haacke: Designers do care about manufacturing with a primary focus on the impact of design rules provided by the foundries.  The more design rules for which they are compliant, the more flexible they can be when choosing a foundry and mitigating risks if some natural disaster impacts one foundry over another. Regarding supply-chain influence, there are many aspects to consider. Designers would not be impacted by material supply disruptions because they typically do not ‘design in’ any of the materials used in manufacturing. However, a closed-loop feedback to designers on manufacturing test results – tied to requirements and design intelligence – can improve responsiveness to design-related issues impacting yield ramp-up.

Sherwani: It doesn’t require an earthquake or other natural disaster. In the coming move from traditional single-die chips to the era of 2.5-dimensional (2.5D) stacked dies, everything changes. With 2.5D, naked dies have to be tested and then placed on interposers and positioned into a single package. The industry has never tested or sold anything like this before. I think it will disrupt the normal supply chain and its well-understood chain of command.

Annesley: Design needs to be linked to execution in the global market. You need a feedback mechanism for companies to decide the best price and combination of packaging and manufacturing processes that result in the lowest-cost chip. That is a good example of tying back execution data to the design process and vice versa. For example, you have the material information for your design – be it chip or board. You may have alternates that you need to use (e.g., due to natural disasters). It is important for companies to track what actual alternates were picked for every component build. They will then have traceability and accountability with respect to the specifications.

Ford: Designers are motivated to create a product that meets the criteria set in terms of technologies, materials, costs, quality, life expectancy, etc. There is a significant influence on this from the manufacturing-production side, which - if not known by the designer – can result in variations in the product and the product not living up to expectations. Designing a product with some knowledge of the materials to be used and the actual production environment would give the designer the opportunity to design-in features that promoted better production quality, lower manufacturing cost, or reduced variation. Typically, though, the technologies of material choice and manufacturing capability are not visible in a way that designers can understand. So this does not happen except in rare cases. This is a clear opportunity for improvement.

 

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Tweets From GlobalPress, GSA, and the Pauling Lectures

The week as tweets with bird-sized bits of content covering a broad, birds-eye view of technology and science from three different events.

Here’s a summary of all of the events I attended this week - from a science lecture on disruptive science to the breadth of technology showcased at the Globalpress event and yesterday’s GSA Silicon Summit. – JB

jblyler @Dark_Faust — Past 190-nm nodes benefit from leading edge, e.g., enhanced power – Heinlein @ARMCommunity @GlobalSemi @chipestimate #semieda #semip – (20h ago)

Ethernet service revs grow to $48b by 2016 – Uday Mudio @vitesse #esummit13 #semip @chipestimate #semieda – (1 day ago)

Phone becomes game console w/ SlimPort. BT connects handset @Analogix #esummit13 #semip @chipestimate #semieda pic.twitter.com/ByNfeCIT5a – (1 day ago)

Phone becomes game console w/ SlimPort. BT connects game handset @Analogix #esummit13 #semip @chipestimate #semieda pic.twitter.com/tVdtEEVv2R – (1 day ago)

Subsystem #IP – Now need hooks among diff subsystems, integration. Rowen @tensilica #esummit13 #semip @chipestimate #semieda @Chip_Design – (1 day ago

200 global licenses with 2.4B cores in market – impressive @tensilica #IP footprint. Rowen @tensilica #esummit13 #semieda @chipestimate – (1 day ago)

#IP evolves – bazaar (pieces) to superstore (off shelf) to factory (configured). Rowen @tensilica #esummit13 #semip @chipestimate #semieda – (1 day ago)

@Algotochip IP ecosystem continues to grow with ARM, Tensilica-Cadence and others. #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

@IntelSys #embedded SW tools open? Not Eclipse based, but have plugins. #esummit13 #semieda #semip @chipestimate @Chip_Design

Power of less concern than performance for #embedded SW dev – @VDC_Research @IntelSys #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

Intelligent #embedded sys must connect to world – Hinstorff @IntelSys software #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

“Watts? Joules?” SW developer power dilemma says Glenn Perry @mentor_graphics #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

RT @Nu3dPrinters: @Dassault3DS: #3DEXPERIENCE Customer Forum China 2013 #3DXforum 3ds.com/company/events… pic.twitter.com/rowcau0fbo” – (2 day ago)

“Most system delays come when HW and SW integrated.” Rhines, @mentor_graphics #esummit13 @Portland_State #semieda #semip @chipestimate – (2 day ago)

Emb sw dev headcount surges every node – 17x between 90 to 14 nm. Wally Rhines, @mentor_graphics #esummit13 #semieda #semip @chipestimate – (2 day ago)

Customer Specific Standard Products focus on mobile subsystem, programmed @quicklogic #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

Measuring pressure of fly (3Pa) possible with electronic skin. Zhenan Bao @Stanford #esummit13 #semieda #semip @chipestimate @Chip_Design – (2 day ago)

IP integration w IPExact packager + smart subsystem creator. Vivado @xilinx Tom Feist #esummit13 #semieda #semip @chipestimate @Chip_Design

Green computing Calxeda uses @ExarCorp power management for ARM-based microservers. #esummit13 #semieda #semip @chipestimate @Chip_Design

From fish eye to panoramic view w zero content loss – Geo Semi #esummit13 #semieda #semip @chipestimate @Chip_Design pic.twitter.com/bSjMKo7A7u

@Stanford Yi Cui at #esummit13 – Can paper industry be saved w nanotube-embedded, paper batteries? #semieda #semip @chipestimate.com

TV turner fabed at 55 nm. Sweet spot for RF and digital, via Silicon Lab’s Stansberry at #esummit13. @silabs #semieda #semip @chipestimate

@altera advances high speed optical network IP by acquiring Danish TRACK via Vince Hu #esummit13 #semieda #semip @chipestimate @Chip_Design

ARM still strong partner even with Intel 14-nm finfet fab word, says @altera Vince Hu #esummit13 #semieda #semip @chipestimate @Chip_Design

Antenna freq tuning w MEMS caps ups gain by 1.3 dB or 35% via Yost Cavendish Kinetics #esummit13 #semieda #semip @chipestimate @Chip_Design

ARM still strong partner even with Intel 14-nm finfet fab word, says @altera Vince Hu @esummit13 #semieda #semip @chipestimate @Chip_Design

@altera advances high speed optical network IP by acquiring Danish TRACK via Vince Hu @esummit13 #semieda #semip @chipestimate @Chip_Design

TV turner fabed at 55 nm. Sweet spot for RF and digital, via Silicon Lab’s Stansberry at @esummit13. @silabs #semieda #semip @chipestimate

@Stanford Yi Cui at @globalpresspr – Can paper industry be saved w nanotube-embedded, paper batteries? #semieda #semip @chipestimate.com

“All science is either physics or stamp collecting.” – Rutherford @InstforScience @chipestimate @SemiEDA @eda @terrybristol

ISEPP Lecture – Dr. Dupree – Myth 1: Science discovers true divisions in world. @InstforScience @chipestimate @SemiEDA @eda @terrybristol

ISEPP: The Hunt for Earth 2 – A Shower of Kepler Planets! bit.ly/10QSEgN @InstforScience @chipestimate @terrybristol @SemiEDA @eda



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IP Smoke Testing, PSI5 Sensors, and Security Tagging

The growth of semiconductor IP brings challenges for subsystem verification, integration, security, and the addition of sensor standards. Can Savage clear the smoke?

Warren Savage, marathon runner and President & CEO of IP-Extreme, talks about the trends, misconception, and dangers resulting from the increasing popularity of semiconductor intellectual property (IP). What follows is the first portion of a two-part story.

Blyler: Let’s start by talking about trends in IP for field-programmable-gate-array (FPGA) and application-specific-integrated-circuit (ASIC) systems-on-a-chip (SoCs). What’s new?

Savage: If you look at global macro trends, you’ll see an increased amount of customization. For example, the iPhone can be customized “six ways to Sunday.” I’m starting to see something similar in the semiconductor space, where companies are differentiating themselves through IP and putting it together in different ways. Some guys – the Broadcoms and Qualcomms of the world – can do huge quantities of SoCs. But many mid- and lower-tier guys are doing more customized types of products that appeal to a certain niche market. [Editor’s Note: Makimoto’s Wave remains in its customization cycle.]

If the volumes are low enough, an FPGA with the right IP could offer a big differentiation from an off-the-shelf (ASIC) SoC. I’m seeing more of that trend and it gets stronger every year.

Blyler: The numbers are showing that IP continues to be a larger share of the revenue. How about subsystem IP? Is it starting to take off – perhaps in the vertical integration of certain types of IP?

Savage: One of the artifacts of the downturn from several years ago is that fewer engineers must do more increasingly complex things. We are seeing people buy more of our subsystem IP that includes the processors, bus infrastructure, and peripherals needed to run a real-time operating system (RTOS). People want to buy the whole thing and start with a working platform, then add their IP around that platform.

Blyler: Won’t the move toward subsystem IP lead to more verification and integration issues? Does the entire subsystem then come with a suite of tests or do you need to test each IP block individually?

Savage: The expectation is that the subsystems are fully verified and come to the designer as a black box. Typically, people don’t re-verify things of that complexity; it is too much. Plus, it has already been verified at the subsystem level by the IP provider. What the IP provider supplies is some type of integration-level test so the designer can – for lack of a better word – run a “smoke test” to ensure that the subsystem is installed properly and fundamentally working. In processor-based designs, it means you can run software like a “hello world” test that verifies all of the memory, interface, and peripheral connections.

Not a lot of extra verification tests come along with the IP. After all, the IP is expected to be used as a black box.

Blyler: With the rise of sensors in our increasingly connected world, I would expect to see more sensor-related IP. Is that the case? Or is it a microelectromechanical-systems (MEMS) technology and fabrication issue?

Savage: One of our major customers is a provider of automotive sensors. They use MEMS technology for sensors, accelerometers, etc. – as part of their products. But these MEMS chips and sensors still need to be connected into an SoC. That’s why we’re seeing interest in the Peripheral Sensor Interface 5 (PSI5) standard, which is a specific interface dedicated to automotive sensor applications. PSI5 is kind of an upgrade to the Local Interconnect Network (LIN) standard.

Here is an overview of hardware interfaces (courtesy of Vector).

For background, there’s a hierarchy of automotive interface standards. At the low end of complexity is LIN, which is typically used to control the mirrors on a car via a driver-side toggle switch. Next comes the controller-area-network (CAN) bus interface, which has a lot more bandwidth for moving data around. CAN is used for suspension, airbags, etc.

Lastly, FlexRay is a true vehicle network for real-time apps. Eventually, it will give way to a drive-by-wire or steer-by-wire implementation.

Blyler: What’s new on the security front for semiconductor IP?

Savage: On the commercial side, I’m seeing less and less concern about security. But there are some developments that will be important. For some time now, there has been an IEEE standard on hard IP tagging that allows you to track cores at the GDS level. (Editor’s Note: Hard IP is offered in a GDSII format and optimized for a specific foundry process.)

The thing that has been missing is what to do about soft IP. (Editor’s Note: Soft IP is synthesizable in a high-level language like RTL, C++, Verilog, or VHDL.) Watermarking the code is a common approach for tracking soft IP and one that we use at IP Extreme. I’ve been working with Kathy Werner, who heads a committee on soft-IP tagging. She has worked with IP at Freescale and then Accellera. Her committee is incorporating many of the same conventions into soft IP that proved successful in hard IP. The goal is that these soft-IP security mechanisms will work throughout the EDA-tool design flow to be propagated downward into the GDSII. In other words, the high-level soft-IP tags could be detected at the GDS level.

Related Stories:


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Do 3D Printers Challenge Semiconductor IP and Fabs?

What does a futuristic matter replicator from the ’70s have to do with today’s patent and semiconductor IP systems? The answer lies in 3D printers.

Remember the replicators from the 1970s “Star Trek” TV show? These futuristic devices could create anything from meals and engine parts to phaser handguns. Some consider today’s 3D printers to be an early version of that futuristic device. Setting aside technical considerations, the ability for almost anyone to create a 3D object raises unprecedented patent and even semiconductor intellectual-property (IP) issues. I’ll explain the IP part shortly. First, though, let’s talk about this new class of printing (manufacturing?) technology.

The printing of three-dimensional (3D) objects is moving from the domain of corporations and R&D organizations to the general public. Large companies have long used 3D printers to create physical models of future products. Thanks to cost efficiencies, many small businesses and modeling hobbyists now own 3D printing technology. Granted, it will still be many years before 3D printers – like the MakerBot – become household items (mainly due to cost and quality issues).

To fabricate a 3D object, one must start with a design file – created from scratch or drawn/traced from an image scanned in three dimensions. Several consumer-friendly software applications, such as Autodesk’s 1-2-3D, allow a novice to easily design objects using a variety of sample libraries.

Next, the 3D design is compiled into a series of 2D cross-sectional planes. A special printer then deposits layers of material – typically plastic or metal – one atop the other in the shape of each 2D plane. As the 3D object is constructed, the planes are fused and the fabricated object is treated and hardened.

Here's a very brief video of the Makerbot Replicator 3D printer building a "monster" that was created on an iPad running Autodesk's 1-2-3D apps. This was taken at a party the night before the main Game Dev. Conference event.

What does the fairly easy and relatively inexpensive creation of 3D objects have to do with IP concerns? For now, very little. Like the early days of music file sharing via MP3 devices, the start of low-cost, consumer 3D printing hasn’t promoted a great deal of concern from the patent office. Indeed, most existing patents and registered designs allow exemptions for personal use, such as building spare parts or one-off replacements.

What happens, though, as 3D printing technology matures – as did the consumer PC market with ever-decreasing costs and increasing capabilities? There may well come a time when 3D printers are of such quality and proliferation that they impinge upon commercial manufacturers and abuse patent and IP rights. Could the major semiconductor fabs eventually surrender low-cost, low-production-volume product lines to an army of 3D printers (see RepRap)?

This idea might not be as crazy as it seems. In a manner similar to the photo-lithography used in today’s IC manufacturing, stereo-lithography – or optical fabrication – is a 3D printing technology based on ultra-violet-curable resins. Both photo- and stereo-lithography use standard patterning techniques to create a multilayered product.

Most advocates for 3D printing technology admit that the household use of such printers is a decade away. Is this true for the semiconductor IP market? Already, many R&D facilities – as well as hobbyists – have used 3D printers to create 8-bit integrated circuits. It’s not difficult to create the basic building blocks of electronics (i.e., transistors) using 3D printers configured as plotters. Organic FET recipes exist on the Internet. In addition to transistors, many other components are printable – from solar cells, batteries, and displays to passive elements like resistors and capacitors.

Silicon thin-film transistors (TFTs) enable high-performance circuits at low process temperatures. (Courtesy of John Sarik, Columbia University, at OSCON 2012 – Portland, OR)

Still, it seems doubtful that the semiconductor IP market will face serious challenges because of the evolution of 3D printing technology. Instead, such technology will service niche markets in the low-end electronics industry (e.g., the design and manufacture of simple 8-bit circuits for disposable applications like medicine dispensers and even interactive cookie boxes; see “Organic Processors Offer Microwatt Applications“).

In the future, 3D printers may lead to fundamental changes in the manufacturing sector. What this will mean to the IP business can only be imagined.



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GPU Demo Impresses at Game Developer Conference Event

ARM’s Mali performance benchmark on the Samsung Nexus 10 is impressive, but Imagination Technologies’ graphic IP proves competitive.

Last night, I attended a pre-Grame Developer Conference (GDC) get-together sponsored by ARM. The theme for this casual event was the future of mobile gaming and how we can navigate today’s industry challenges.

For me, the evening’s high point was a group discussion with Nizar Romdan, Director of Ecosystem at ARM’s Media Processing Division. The foremost question at our table concerned the performance edge of graphical processing units (GPUs) in comparison to ARM’s well-known CPUs.

Romdan answered this question with a live demonstration using Samsung’s Nexus 10 tablet. The tablet’s camera provided a real-time video feed of other attendees at a nearby table. Various filters were applied to the video from the image signal processor – first a blur and then a pencil (or LaPlacian) filter. The first pass of each filter was implemented via the Mali GPU (at 19 FPS). When processing was switched from the GPU to the basic CPU, the quality of the stream dropped to 5 FPS. This made it very difficult to track any movement on the display (see video).

Live demo of ARM’s Mali GPU versus ARM’s CPU performance on the Samsung Nexus 10.

The demonstration benchmark between ARM’s CPU (Cortex M15) and GPU (the new Mali T604) was optimized for resolution. In the near future, there will be a similar benchmark for low power.

The resolution quality and speed of the benchmark was impressive. To play the devil’s advocate, though, I asked Romdan what he thought about the recent shift at Samsung from ARM’s Mali to Imagination Technologies’ GPU core – most recently in the Samsung “Octa” chip for smartphones.

He noted that Samsung had many suppliers – from ARM and Imagination Technologies to Qualcomm and even TI. Furthermore, Samsung used different suppliers for different product segments (e.g., Samsung’s Smart TV uses the Mali GPUs). “ARM’s Mali remains Samsung’s largest market volume,” added Romdan. “Over half of the Android-based tablets and 20% of smartphones use Mali GPUs.”

The latest T640 Mali line will be manufactured using 28-nm-process-node technology. Romdan couldn’t say whether it would implement FinFET devices or which foundry would be used.

Related video:

  1. This video highlights the three common types of filters used to benchmark processing performance - be it from a CPU, GPU, or an FPGA running optimized algorithms in C-code: “Hotspot Parallelization of C-Code to X86 or FPGAs.”

 

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Mixed-Signal and RF Help Drive Silicon-on-Insulator Growth

Here’s another example of the growing importance of analog/mixed-signal, RF-wireless, and silicon-on-insulator technologies.

Several recent announcements confirm the convergence of analog/mixed-signal circuits and silicon-on-insulator (SOI) -based technology. First, Altis announced its foundry partnership deal with IBM’s 180-nm SOI technology. This agreement allows the processor giant to leverage Altis’ analog/mixed-signal and RF expertise. Secondly, Cadence has agreed to acquire Cosmic Circuits, a major mixed-signal IP company (see “Raising The Stakes For IP”).

Adele HARS at Advanced Substrate News (ASN) has reported that over 50% of smartphones and tablets contain SOI technology – used both in processors and new-generation RF chips. “Soitec says it’s shipped over 200,000 engineered wafers to customers making chips for mobile communication this fiscal year. Those wafers translate into about 2.5 billion ICs for RF front-end module apps, which covers half of the 600 million smartphones and 100 million tablets expected to be produced this year,” noted HARS.

In the SOI process, a thin layer of silicon is deposited onto an insulating substrate at high temperature. When compared to bulk CMOS, the insulating substrate provides much lower parasitic capacitance. Such low capacitance, in turn, improves the speed and linearity of the circuit at lower power.

One of the first silicon-on-insulator semiconductor manufacturing technologies used in the RF space was silicon-on-sapphire (SOS; see “Noble Award Honors Low-Power RF Technology”).

For IP designers, the implementation material – be it bulk CMOS or SOI – has only minor impact on the design. In terms of manufacturability, however, SOI helps to extend the value of geometrics that are not on the “leading edge.” This is good news for an industry that may be hitting the wall in terms of the cost benefits of digital scaling.

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