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Viable Product Development at 22 nm
Kalar Rajendiran
eSilicon Corporation |
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Why an integrated value chain is becoming critical and where to find the necessary expertise to make all the pieces work together.
Introduction
The end of classical scaling at 90nm and the introduction of a broad array of challenges that now have to be dealt with at every process node beyond 65nm has changed IC design forever. Design, manufacturing and production must be tied together more closely than ever in order to address the challenges of power, ESD, EMI, IP integration, complex packaging options, manufacturing yield... few companies have the focused resources within each of these disciplines to successfully complete chips. Fabless semiconductor companies and medium-sized semiconductor companies that own their own fabs are forced to reconsider their business models looking outside for the high level of expertise required to complete design and manufacture of chips.
more >> |
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Smart Analog
Custom Interface Components that
Bridge the Divide from A to D more >>
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EDIF tools, Parsers, Visualize EDIF or Verilog netlists, Intelligent PDF more >> |
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PLLs and DLLs - 180-28nm
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Lowest Power Memory IPs
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READ at <1V...NSCore OTP |
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NVM Solutions
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Demystifying Non-Volatile Memory IP:
Selecting the Right NVM IP for SoC Designs Targeting Wireless,
Analog, Micro-electro-mechanical Systems and Security Applications.
Download Whitepaper
more >>
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FlipChip International and Fujikura Forge Partnership for Advanced...
TOKYO, June 13, 2011 - Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next...
Mixel Achieves First Silicon Success with its MIPI M-PHY IP
Mixel's customers are saving several man-years of platform development effort San Jose, CA - June 13th, 2011 - Mixel Inc., the...
NVIDIA Completes Acquisition of Icera, a Leader in Wireless-Modem, RF...
SANTA CLARA, CA - Jun 13, 2011 - NVIDIA announced today that it has completed its $367 million cash acquisition of Icera, a leading innovator of...
NXP Announces Grand Prize Winner of First-Ever High Performance RF...
EINDHOVEN, NETHERLANDS and NIJMEGEN, NETHERLANDS - Jun 13, 2011 - In an awards ceremony held at IEEE MTT-S International Microwave Symposium for...
China fabless market set to double by 2015, says IHS iSuppli
Driven by strong domestic demand and soaring exports, China's fabless semiconductor market is on a high-growth trajectory, with revenue set to
Zoom Imaging Inc. Wins Coveted Dealer of the Year Award from Toshiba...
IRVINE, Calif. - Toshiba America Business Solutions Inc. (TABS) proudly announced today that Zoom Imaging Solutions, Inc. has won Toshibas Dealer of...
Zodiac Interactive Showcases Breakthroughs at The Cable Show in Chicago
iTV Leader To Demo its Server-Based, Patent Pending AMS Cloud Solution Enabling Multi-Screen Convergence For and Between Legacy, Next-Gen, Mobile,...
Mellanox and Correlix Introduce Industry's First Commercial Latency...
Joint InfiniBand Latency Monitoring Solution Provides High-Frequency Trading Firms with Greater Transaction Insight and Visibility SIFMA 2011 ...
Synopsys Custom Design Solution Enables Moortec Semiconductor to Tape...
Unified Solution Streamlines Development of Embedded Temperature Sensor IP for 65nm, 40nm and 28nm Geometries MOUNTAIN VIEW,...
Companion Apps Now Available in AutoCAD 2012
New In-Product Access to Download, Buy and Sell Apps and Content SAN RAFAEL, Calif. - Autodesk, Inc. (NASDAQ:ADSK), a...
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Algotronix offers the leading AES cryptography solutions for FPGA or ASIC.
Widely adopted in defense and communications, these highly configurable cores
are supplied in VHDL or Verilog. The range spans AES-GCM, CCM, XTS and MACsec
to cover wired, wireless and storage applications to 40+ Gbps. Customized solutions
and interfaces provide your exact needs using a minimum of chip resources. more >>
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