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Highly-Integrated, low-power, low-cost audio platform targeting high-volume markets such as portable audio players & cellphones

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CEVA
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IP Name
CEVA-Audio Platform Solution
Provider

CEVA

Description

Highly-Integrated, low-power, low-cost audio platform targeting high-volume markets such as portable audio players & cellphones

Categories
Portability
ASIC, FPGA, Structured
Process Node
all
Type
Soft IP
Maturity
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Overview
CEVA-Audio is a low-power, low-cost platform that combines several CEVA-developed technologies including CEVA-TeakLite-II™, the enhanced version of the widely-adopted CEVA-TeakLite DSP core, an Xpert-TeakLite-II subsystem, consisting of a cache memory, audio peripherals, a comprehensive set of audio codecs and complete tool chain support.

CEVA-Audio, a fully synthesizable soft IP, operating at up to 200MHz, is built on top of a small DSP core and incorporates a cache memory subsystem. Power consumption is 0.1 mA/Mhz for stereo MP3 decoding and the smallest die size configuration starts at two square millimeters using TSMC 0.13u G process.

The CEVA-Audio solution uses the CEVA-TeakLite-II DSP core, which is an enhanced version of the widely deployed and commercially successful CEVA-TeakLite DSP core, providing the best price/performance ratio in the market.
Features
  • A licensable portable audio design
  • Integrated, programmable audio platform
  • Low cost - 2 sq mm for combined DSP, subsystem and on-chip memories
  • Low power - 0.1 mA/MHz for stereo MP3 decoder
  • Leverages on widely-deployed CEVA-TeakLite technology
  • Single source solution - Reduces risks and solution complexity
  • Qualified IP - Robust RTL to GDSII design flow using mainstream, industry-standard EDA tools
  • Complete development tool chain - Compiler, debugger, linker, IDE, Profiler
Deliverables
  • Fully synthesizable RTL, including synthesis and layout scripts and guidelines
  • Complete set of SW and HW development tools
Market Category
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
Datasheet
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Bus Interface
AMBA
Gate Count
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QIP Rating  This IP is not yet QIP rated.
 
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Keywords
Node
28nm      40 nm      55 nm      90 nm      150 nm      250 nm     
32nm      45 nm      65 nm      130 nm      180 nm      350 nm     
Foundry
Common Platform
GLOBALFOUNDRIES
IBM
SilTerra
SMIC
TSMC
Tower
UMC
X-FAB
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Category
Vendor
Portability
ASIC FPGA Structured
IP Quality
QIP Rated

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