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Standard cells in 180 nm - Dual Voltage, High Speed, Patented

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Dolphin Integration
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IP Name
SESAME eLC DV TSMC 180 nm G
Provider

Dolphin Integration

Description

Standard cells in 180 nm - Dual Voltage, High Speed, Patented

Categories
Portability
ASIC
Process Node
180nm/TSMC
Type
Hard IP
Maturity
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Overview
A DUAL VOLTAGE LIBRARY FOR IMPRESSIVE POWER REDUCTION!

Reducing the overall power consumption of a SoC is a critical issue for SoC designers, especially for battery-powered applications.
SESAME eLC DV is the result of Dolphin's 20 years' low power expertise. As opposed the usual so-called "dual voltage" libraries which are only basic libraries characterized at lower voltage, the architecture of SESAME eLC DV is specifically designed to enable robust dual voltage operation, with characterizations taking into account physical phenomena linked to low voltage. SESAME eLC DV is characterized for 1.8V +/-10% and 1.1V +/-10%

Thanks to its patented implementation, SESAME eLC DV is the optimal solution for applications such as Wireless Sensors, low power MCUs, RFID or Medical.
Features
  • Power consumption is divided by up to 5
  • Leakage is divided by up to 2
  • Safe and Patented low voltage operation
  • High speed optimized architecture for critical designs
  • High routability
Market Category
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
Datasheet
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Size
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QIP Rating  This IP is not yet QIP rated.
Customer Testimonial

"SMIC and Dolphin Integration announce their partnership for the release of low power audio converters. "We are enthusiastic", declared Henry Liu, SMIC Senior Director of Design Services. "As a leading foundry that is recognized worldwide, we wanted the benefit of relying on Dolphin’s robust audio virtual components for providing customers with the best performance mix for high volume SoCs."

Henry Liu, SMIC Senior Director of Design Services
SMIC

 
 
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Keywords
Node
28nm      40 nm      55 nm      90 nm      150 nm      250 nm     
32nm      45 nm      65 nm      130 nm      180 nm      350 nm     
Foundry
Common Platform
GLOBALFOUNDRIES
IBM
SilTerra
SMIC
TSMC
Tower
UMC
X-FAB
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Category
Vendor
Portability
ASIC FPGA Structured
IP Quality
QIP Rated

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