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USB 2.0 HSIC PHY for LFoundry 150nm

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Evatronix
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IP Name
USBHSIC-PHY
Provider

Evatronix

Description

USB 2.0 HSIC PHY for LFoundry 150nm

Category
Portability
ASIC
Process Node
150nm
Type
Hard IP
Maturity
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Overview
The USBHSIC-PHY is a complete mixed-signal transceiver macro-cell that implements the USB 2.0 High Speed Inter Chip (HSIC) layer for USB 2.0 High Speed Device and Host applications.

The USBHSIC-PHY consists of a logic macro, which is available as either hard or soft IP, and a hard-IP block that contains the special driver circuit that is mandated by the HSIC specification.

The HSIC standard exists because there are many applications where it makes sense to embed a subsystem that uses USB 2.0 within embedded applications that do not need to be connected to external devices.

The USBHSIC-PHY can be used for subsystems within a smartphone. The big advantage over conventional USB2 is the elimination of most of the power consumption and most of the chip area that would be required for conventional USB2 PHYs.
Features
  • 8-bit (optionally 16-bit) parallel UTMI+ interface
  • Built-in Self Test
  • Scan-based DFT
  • 1.2V±10% driver supply
Deliverables
  • Design files kit
  • Extensive documentation
Market Category
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
Datasheet
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Size
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QIP Rating  This IP is not yet QIP rated.
Customer Testimonial

"Fujitsu Telecommunications Europe was recently presented with a major product re-design issue that required a significant number of its design and development processes to be fast-tracked against a very aggressive timeframe. We engaged with Evatronix to assist us in this endeavour and were highly impressed with the responsiveness, quality of work and professionalism of the company. We would quite happily work with Evatronix in the future. "

Mark Hanvey, Director of Procurement
Fujitsu Telecommunications Europe Ltd

 
 
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Keywords
Node
28nm      40 nm      55 nm      90 nm      150 nm      250 nm     
32nm      45 nm      65 nm      130 nm      180 nm      350 nm     
Foundry
Common Platform
GLOBALFOUNDRIES
IBM
SilTerra
SMIC
TSMC
Tower
UMC
X-FAB
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Category
Vendor
Portability
ASIC FPGA Structured
IP Quality
QIP Rated

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