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NVM for HDCP, Conditional Access, and DTCP Key Storage. 8Kb to 64Kb.

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Kilopass Technology
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IP Name
HDCP-DTCP-CA-Keys-TSMC-NVM-45nm
Provider

Kilopass Technology

Description

NVM for HDCP, Conditional Access, and DTCP Key Storage. 8Kb to 64Kb.

Categories
Portability
ASIC, FPGA, Structured
Process Node
45nm/TSMC
Type
Hard IP
Maturity
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Overview
Kilopass Technology's Extra Permanent Memory or XPM technology is built using standard, commercially available CMOS logic process technologies and is silicon proven to deliver high density, high performance, and high reliability electrically field-programmable embedded NVM solutions at a low cost. A unique benefit of XPM embedded NVM technology is that it provides designers with a physically secure (Xtreme Security) non-volatile memory technology that is very high density. Over 50+ customers have integrated XPM in over 150+ designs from 180nm to 65nm. Applications range from a few hundred bits for unique ID to prevent cloning to multiple instances of 1Mb for program code storage. Many of the designs up to 90nm are ramping up to high volume production or have been in high volume production since 2003. XPM can store industrial digital authentication standards. - Conditional Access - HDCP (Interface: USB, MOST, Bluetooth, TCP/IP) - HDCP (Interface: HDMI, DVI, Display Port, GVIF, UDI) Keywords: nonvolatile memory, OTP, MTP, one-time programmable, HDCP, CA, DTCP, encryption keys, digital rights management, DRM, fuse, security, keys, trim, calibration, repair, ID, embedded, NVM, code storage, storage, embedded NVM, memory, secure, SOC, non-volatile memory, parametric yield recovery, ROM, sFlash, EEPROM, battery back sRAM, analog tuning, CIS, ROM patching, NVM reliability, firmware storage
Features
  • Standard CMOS, no additional process adder
  • Proven reliability, 1000 hrs HTOL/DRB on 3 lots
  • >10 years retention
  • Xtreme security (physical security) for security key storage
  • Security lock bit(s)
  • Integrated charge pump or external VPP programming option
  • Programmable on at wafer probe, final test, or in the field
  • Built-in manufacturing test patterns
  • Operating temperature range -40C to 125C
  • Low active and standby power
Deliverables
  • Front-end: .lib, .db, .v
  • Back-end: antenna LEF, FRAM, GDS, CDL
  • Collateral: datasheet, test guide, integration guide
Market Category
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
Datasheet
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Bus Interface
Serial/Parallel
Size
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QIP Rating  This IP is not yet QIP rated.
Customer Testimonial

"Kilopass XPM technology allows us to contain our costs, and add new features to our SoCs. "

Niels Thybo Johansen, Vice President R&D
Zensys

 
 
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Keywords
Node
28nm      40 nm      55 nm      90 nm      150 nm      250 nm     
32nm      45 nm      65 nm      130 nm      180 nm      350 nm     
Foundry
Common Platform
GLOBALFOUNDRIES
IBM
SilTerra
SMIC
TSMC
Tower
UMC
X-FAB
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Category
Vendor
Portability
ASIC FPGA Structured
IP Quality
QIP Rated

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