Cadence Design IP SuperSpeed USB3.0 PHY

Estimate your chip with this semiconductor IP

Cadence

IP Name

SuperSpeed USB3.0 PHY for TSMC65nm

Provider

Cadence

Description

Cadence Design IP SuperSpeed USB3.0 PHY

Category

IP Catalog : On-Chip Bus IP : USB

Portability

ASIC

Process Node

65nm/TSMC/LP, G, GP

Type

Hard IP

Maturity

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Overview

The Cadence® SuperSpeed USB 3.0 IP is a fully integrated USB3.0 interface solution, optimized to reduce the cost of integrating and verifying a system-on-a-chip and the associated embedded software. The solution can contain either a host or device controller, configured to meet the exact functional and integration needs of the system. Related Integration-Optimized IP from Cadence 1) Superspeed USB3.0 Host Controller 2) Superspeed USB3.0 Device Controller

Features

Compliant with USB3.0 Specification Version 1.0

Spread spectrum clock/data recovery system and data scrambling to minimize EMI

8b/10b encode/decode

Low power: supports all USB 3.0 power management modes, and includes extensive low power features

USB3.0 PIPE interface with configurable width (8/16/32 bits)

Advanced mixed signal analog tools and techniques insure high yield and margin for package and board variations

Optional USB2.0 PHY, for backward compatibility, with UTMI/ULPI interfaces

Deliverables

Specification/Datasheet with Integration Guidelines,

Verilog Model (.v), Abstract (.LEF),

LVS Netlist (.cdl), Timing model (.lib),

GDSII (with associated stream map file), Physical Verification Summary Files

CIP-1011

Market Category

Consumer Electronics, Data Processing, Others

Datasheet

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Bus Interface

PIPES

Size

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QIP Rating

This IP is not yet QIP rated.

Customer Testimonial

"Cadence® USB 3.0 verification IP has enabled us to thoroughly verify that our designs comply with the USB 3.0 specification, and this new SSIC product demonstrates the company’s commitment to supporting engineers working with this key protocol. By supporting all popular verification methodologies and simulators, the Cadence VIP has enabled GUC to support our diverse customer base with high-quality SoC and IP verification coverage. "

James Cheng, Senior Vice President
Global Unichip

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