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split stereo audio CODEC ultra Low Power consumption

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Dolphin Integration
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IP Name
sCODS95-N.01-Helium3-Bow
Provider

Dolphin Integration
Description

split stereo audio CODEC ultra Low Power consumption
Categories
Portability
ASIC
Process Node
180nm/TSMC
Type
Hard IP
Maturity
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Overview
SoC integrators targeting portable audio applications such as Smart Phones, PMP, PDA… should demonstrate optimal recording performances as well as the best sound quality, while starring the longest playback capability.
sCODS95-N.01-Helium3-Bow, benefits from a new architecture combining the low power consumption from Helium architecture with ultra High Density. This audio CODEC silicon IP is thus the best ally of SoC integrators targeting high volume markets.
The Bow interface which enables to split the analog and digital parts on 2 separate dies offers ultimate flexibility. The highest density can be achieved by embedding the logic part in advanced process, such a split configuration ensures the easiest adaptations of digital functionalities for supporting various applications. Both parts are delivered in GDSII format, for a fastest and safest integration of the audio CODEC silicon IP.
Features
  • Ultra High Density for lowest fabrication cost:
  • High resolution: 95 dB SNR on the DAC to HP path
  • Smooth design-In
  • Patented PLL-less solution to avoid jitter due to audio PLL
Market Category
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
Datasheet
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Size
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QIP Rating  This IP is not yet QIP rated.
Customer Testimonial

"SMIC and Dolphin Integration announce their partnership for the release of low power audio converters. "We are enthusiastic", declared Henry Liu, SMIC Senior Director of Design Services. "As a leading foundry that is recognized worldwide, we wanted the benefit of relying on Dolphin’s robust audio virtual components for providing customers with the best performance mix for high volume SoCs."

Henry Liu, SMIC Senior Director of Design Services
SMIC
 
 
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Keywords
Node
28nm      40 nm      55 nm      90 nm      150 nm      250 nm     
32nm      45 nm      65 nm      130 nm      180 nm      350 nm     
Foundry
Common Platform
GLOBALFOUNDRIES
IBM
 SilTerra
SMIC
TSMC
 Tower
UMC
X-FAB
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Portability
ASIC FPGA Structured
IP Quality
QIP Rated

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