SoC integrators targeting portable audio applications such as Smart Phones, PMP, PDA… should demonstrate optimal recording performances as well as the best sound quality, while starring the longest playback capability.
sCODS95-N.01-Helium3-Bow, benefits from a new architecture combining the low power consumption from Helium architecture with ultra High Density. This audio CODEC silicon IP is thus the best ally of SoC integrators targeting high volume markets.
The Bow interface which enables to split the analog and digital parts on 2 separate dies offers ultimate flexibility. The highest density can be achieved by embedding the logic part in advanced process, such a split configuration ensures the easiest adaptations of digital functionalities for supporting various applications. Both parts are delivered in GDSII format, for a fastest and safest integration of the audio CODEC silicon IP.
Ultra High Density for lowest fabrication cost:
High resolution: 95 dB SNR on the DAC to HP path
Patented PLL-less solution to avoid jitter due to audio PLL
Automotive, Communications, Consumer Electronics, Data Processing, Industrial and Medical, Military/Civil Aerospace, Others
"SMIC and Dolphin Integration announce their partnership for the release of low power audio converters. "We are enthusiastic", declared Henry Liu, SMIC Senior Director of Design Services. "As a leading foundry that is recognized worldwide, we wanted the benefit of relying on Dolphin’s robust audio virtual components for providing customers with the best performance mix for high volume SoCs."
Henry Liu, SMIC Senior Director of Design Services SMIC