DSP Shipments Doubled by Tensilica, Ranks Second in DSP IP Market According to The Linley Group
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SANTA CLARA, CA - (June 20, 2012) - Tensilica®, Inc. today announced that it is now ranked second in shipments of chips containing DSP (digital signal processing) IP cores for 2011 by The Linley Group, the industry's leading source for independent technology analysis of semiconductors for networking, mobile, and wireless. Tensilica attributes this growth to its focus on dataplane signal processing and strong unit volumes in smart phones, home entertainment, and communications LTE infrastructure. Shipments of devices with Tensilica DSP cores roughly doubled from 2010 to 2011.
"After examining new data on 2011 shipments, we have determined that Tensilica ranks second in the DSP core market," stated Linley Gwennap, founder and president of The Linley Group. "Moreover, given the current upward trend in Tensilica's DSP core shipments, we believe the company will become an even larger player in this fast-growing market in the years to come. We've seen increasing market acceptance for Tensilica's cores for complex signal processing tasks in high-volume applications."
"Our concentration on the complex challenges in the SOC dataplane has paid off with spectacular growth over the past several years," stated Jack Guedj, Tensilica's president and CEO. "Last year we announced that our licensees had cumulatively shipped over one billion Tensilica IP cores, and we expected to pass the two billion cumulative shipment mark by the end of 2012. Further, recent design wins have yet to be factored into the market share numbers. We look forward to additional explosive growth as those new licensees bring their semiconductor designs to the market in the coming decade."
The Linley Group has expanded its market estimate of devices employing licensable DSP cores for 2011 to 1.5 billion chips, of which they estimate Tensilica holds approximately 20 percent of the market.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores with almost 200 core licensees. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
Press Contacts:
Paula Jones
(408) 327-7343
paula@tensilica.com
Erika Powelson
(831) 424-1811
erika@powelsoninc.com
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