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ChipEstimate.com Headline News
January, 2010 Archive

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Friday January 29, 2010
Industry Headline

Northstar Electronics, Inc. (NEIK) Receives Contract Add-On From L-3

Northstar Electronics, Inc.L-3

VANCOUVER, BC--(Marketwire - January 29, 2010) - Northstar Electronics, Inc. (OTCBB: NEIK) announces that its wholly owned subsidiary, Northstar Network Ltd. (NNL),has received an add-on to the US$2.5 million contract previously awarded by L-3 Communications MAPPS Inc. (L-3 MAPPS) to build consoles for the Canadian Navy's...


 
Thursday January 28, 2010
ChipEstimate.com Partner Headline

Cadence Software Validated on STARC QA Database to Help STARC Members Ensure Advanced Chip Design Quality

Validation Suite Ensures High Software Quality for Chip Design

SAN JOSE, CA--(January 28, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS),the leader in global electronic design innovation, and SemiconductorTechnology and Academic Research Center (STARC), the Japan semiconductorindustry consortium, today revealed an ongoing collaboration to leverageSTARC's regression suites to ensure the...


 
Wednesday January 27, 2010
ChipEstimate.com Partner Headline

AEROFLEX GAISLER ANNOUNCES THE NEXT GENERATION LEON PROCESSOR

Gothenburg, Sweden Aeroflex Gaisler AB, a leader in System on Chip (SoC) design, today announced the next generation LEON processor - the LEON4, providing the industry a high performing, licensable 32-bit processor core based on the SPARC V8 architecture. The LEON4 complements the widely used LEON3 processor for...

 
Tuesday January 26, 2010
ChipEstimate.com Partner Headline

Renesas Adopts Cadence Virtuoso Technology for Mixed-Signal and Analog Design at Its Global Design Centers

Constraint-Driven Design and Verification Expected to Reduce Turnaround Time by 30%

SAN JOSE, CA--(Marketwire - January 26, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS),the leader in global electronic design innovation, today announced thatRenesas Technology Corp. has upgraded to the latest version of CadenceVirtuoso technology at its global design centers....


 
Monday January 25, 2010
ChipEstimate.com Partner Headline

Cadence OVM SystemVerilog Solution Enables More Thorough Verification and Reduces Costs at Mitsubishi Electric

Company Cites 40% Reuse Leading to Lower Costs, Better Quality

SAN JOSE, CA--(January 25, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS),the leader in global electronic design innovation, announced today thatMitsubishi Electric Corp. has adopted Cadence verification technology,including a unique adaptation of the OpenVerification Methodology (OVM), that has helped cut...


 
Friday January 22, 2010
Industry Headline

DaouXilicon Joins Tanner EDA Distributor Network to Support A/MS and MEMS Design Customers in Korea

Tanner EDADaouXilicon (Korea)

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Thursday January 21, 2010
ChipEstimate.com Partner Headline

MoSys to Participate in DesignCon® 2010 and Host Press Conference

MoSys Chief Executive Officer Len Perham and VP of Technology Michael Miller to host a press conference on Tuesday, February 2

SUNNYVALE, CA, January 21, 2010 MoSys, Inc., a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), today announced that it will...

 
Wednesday January 20, 2010
ChipEstimate.com Partner Headline

Evatronix USB 2.0 Controller Secures USB Certification for Richnex High Speed USB Transceivers

Bielsko-Biala/Poland & Hsintien City/Taiwan, January 20th, 2010 - The silicon Intellectual Property (IP) provider, Evatronix SA and the mixed signal IC design company Richnex announced the successful USB certification of the Richnex USB transceiver - RN1170, in which the Evatronix USB High Speed On-The-Go Controller IP was implemented as a...

 
Tuesday January 19, 2010
Industry Headline

Calypto Broadens Industrys Most Comprehensive Power Optimization Product Family with New PowerAdviser Flow

Leverages Sequential Analysis Technology to Deliver Most Complete RTL Power Optimization Solution

SANTA CLARA, Calif.--(BUSINESS WIRE)--Calypto® Design Systems Inc. (www.calypto.com), the leader in...


 
Monday January 18, 2010
ChipEstimate.com Partner Headline

Dolphin Integration strengthens their portfolio of Standard Cell libraries with the DUAL innovation targeting Low Power designs

Meylan, France - January 18th, 2010. The HD-BTF Dual Voltage RCSL (Reduced Cell Stem Library) is the latest demonstration of Dolphin Integrations technical know-how on Low Power Silicon IPs.

The new HD-BTF.DV library is first released for the TSMC 180 nm uLL technological variant.

HD-BTF.DV is the custom tailored standard...

 
Sunday January 17, 2010
Industry Headline

Gemaltos Corporate ID Products Enhance Internal Security for the Queensland Police Service in Australia

AMSTERDAM & QUEENSLAND, Australia--(BUSINESS WIRE)--Gemalto (Euronext NL0000400653 GTO), the world leader in digital security, announces it is selected to provide new electronic ID Cards with Australia’s Queensland Police Service. The deployment benefits...


 
Friday January 15, 2010
Industry Headline

Elcoteq Monterrey, Mexico Receives C-TPAT Security Certification

ESPOO, Finland--(BUSINESS WIRE)--Elcoteq SE, a leading electronics manufacturing services (EMS) company with a consistent global reach and complete services to support the entire lifecycle of a product, has recently received the Customs-Trade ...


 
Thursday January 14, 2010
Industry Headline

BroadLight and Realtek Deliver GPON and Active Ethernet Reference Design

Leveraging BroadLight GPON SoC and Realtek Ethernet technologies

SANTA CLARA, Calif.--(BUSINESS WIRE)--BroadLight, the leading supplier of GPON Semiconductors and software, today announced that the company is collaborating with Realtek ...


 
Wednesday January 13, 2010
ChipEstimate.com Partner Headline

Sidense OTP Memory IP Helps "Green Up" Audium's Power Amplifier

OTTAWA and BRISTOL, UK--(January 13, 2010) - Sidense Corp., a leading developerof Logic Non-Volatile Memory (LNVM) IP cores, and Audium Semiconductor, adeveloper of highly efficient audio power amplifier integrated circuits,have announced the use of Sidense's ultra-low-power SLP one-timeprogrammable (OTP) memory in Audium's recently announced high efficiencyAS1001 audio power amplifier...

 
Tuesday January 12, 2010
ChipEstimate.com Partner Headline

Evatronix IP Cores Now Available in the LFoundry Process Design Kit (PDK)

The partnership offers new possibilities for SoC designers and design houses to make use of the Central European silicon manufacturing plant.

Bielsko-Biala/Poland and Landshut/Germany, January 12th, 2010

The silicon intellectual property (IP) provider, Evatronix SA, and Landshut Silicon Foundry GmbH announced today the agreement to support most popular products from the Evatronix...

 
Monday January 11, 2010
Industry Headline

802.11n to Feature in 87% of Wi-Fi-Enabled Smartphones in 2014, According to ABI Research

NEW YORK--(BUSINESS WIRE)--Although 802.11n Wi-Fi technology was found in less than 1% of Wi-Fi-enabled smartphones last year, in 2014 at least 87% of Wi-Fi-capable smartphones will feature this latest of the 802.11 ...


 
Saturday January 09, 2010
ChipEstimate.com Partner Headline

Virage Logic and Conexant Collaborate to Deliver Advanced Audio Solutions for a Broad Range of PCs and Laptops

Conexant to Provide Virage Logic's Sonic Focus Software on Their Audio Codecs to Major PC OEMs Worldwide

LAS VEGAS--(BUSINESS WIRE)--Virage Logic Corporation (NASDAQ:VIRL), the semiconductor industry's ...


 
Friday January 08, 2010
ChipEstimate.com Partner Headline

Cadence Announces Fourth Quarter and Fiscal Year 2009 Financial Results Webcast

SAN JOSE, CA--(January 8, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHO:

Cadence Design Systems, Inc. (NASDAQ: CDNS) to announce fourth quarter andfiscal year 2009 financial results via webcast.

WHAT:

You are invited to attend the fourth quarter and fiscal year 2009 financialresults audio webcast. Participating on the webcast will be...


 
Thursday January 07, 2010
Industry Headline

Avnera Demonstrating Its New Wired-Quality Wireless Audio Technology at CES

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Wednesday January 06, 2010
ChipEstimate.com Partner Headline

eSilicon and Virage Logic Sign Partner Agreement

Partnership Provides eSilicon and Virage Logic Customers Access to a Broad Range of IP, Design and Production Solutions

SUNNYVALE, CA and FREMONT, CA--(January 6, 2010) - eSilicon Corporation, apioneering semiconductor value chain producer (VCP), and Virage LogicCorporation (NASDAQ: VIRL), the semiconductor industry's trusted IPpartner, today announced an agreement for Virage...


 
Tuesday January 05, 2010
ChipEstimate.com Partner Headline

Tensilica Demonstrates Success in Audio/Video and Broadband Communications at CES 2010

Dozens of Products at the Show Integrate Tensilica IP Cores

SANTA CLARA, CA--(January 5, 2010) - A host of products based on Tensilica'sdataplane processors (DPUs) will be demonstrated at this year's CES(Consumer Electronics Show), January 7-10 in Las Vegas. TheseTensilica-enabled products include some of the most advanced, innovativeconsumer devices, including...


 
Monday January 04, 2010
ChipEstimate.com Partner Headline

Arasan Chip Systems Showcases Comprehensive USB 3.0 IP Portfolio at 2010 International CES

Visit Arasan at the USB Techzone in the 2010 International Consumer Electronics Show

San Jose, California - January 5, 2010 - Arasan Chip Systems, Inc. ("Arasan"), a leading provider of Total Intellectual Property (IP) Core Solutions, announced that it continues to experience strong growth, fueled by its SuperSpeed...

 
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