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ChipEstimate.com Headline News
July, 2010 Archive

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Friday July 30, 2010
ChipEstimate.com Partner Headline

Dolphin Integration announces the availability of a flexible CODEC configuration with ultra low power for providing Nomad systems

Meylan, France July 30, 2010. Dolphin Integration launches its prevalent configuration for portable applications, enabling power saving thanks to the ultra low power architecture from Helium2. Benefiting from a 95 dB CODEC with its own embedded regulator and many features, the whole for a small area, is now possible....

 
Thursday July 29, 2010
Industry Headline

Supertex Introduces Off-Line, Scalable Output, Inductorless Switching Regulator

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SR10 Meets Low Power Standby...


 
Wednesday July 28, 2010
ChipEstimate.com Partner Headline

Synopsys First to Deliver High-Performance Audio IP in 40-nm and 55-nm Process Technologies

Low Power, Compact and Highly Modular DesignWare 96 dB Hi-Fi Audio IP Enables Easy Integration into a Broad Range of SoC Applications

MOUNTAIN VIEW, Calif., July 28 - Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the addition of the...

 
Tuesday July 27, 2010
ChipEstimate.com Partner Headline

Virage Logic Continues to Broaden Semiconductor IP Offering with New Portfolio of SoC Infrastructure Solutions

IntegraTM SoC Infrastructure Solutions Provide Physical Design Friendly Technology with Embedded Quality of Service

TAIPEI, Taiwan - SOC SUMMIT

The Integra SoC Infrastructure IP portfolio was designed to be high ...


 
Monday July 26, 2010
ChipEstimate.com Partner Headline

NXP Acquires Jennic to Extend Leadership in Low Power RF Solutions for Wireless Applications

Complementary 802.15.4 and Zigbee-Based Portfolio to Capture Broad Range of eMetering, Environment and Consumer Applications

EINDHOVEN, NETHERLANDS--(July 26, 2010) - NXP Semiconductors today announced its acquisition of Jennic, a leading developer of low power RF solutions for wireless applications in smart energy, environment, logistics and consumer markets.The acquisition will see Jennic's...


 
Friday July 23, 2010
ChipEstimate.com Partner Headline

Microsoft Licenses ARM Architecture

ARM and Microsoft continue relationship with closer access to ARM IP

CAMBRIDGE, UK July 23, 2010 ARM and Microsoft Corp. today announced that they have signed a new licensing agreement for the ARM architecture. The agreement extends the collaborative relationship between the two companies. Since 1997 Microsoft and ARM...

 
Thursday July 22, 2010
ChipEstimate.com Partner Headline

HDL Design House announces HVT MX25L VITAL behavioral model

Belgrade, Serbia July 22nd, 2010 HDL Design House has announced HVT MX25L VITAL behavioral model, fully compliant to Macronix MX25L8006E, 8 Mbit CMOS Serial Flash Memory, REV.0.01, Jan 28,2010 specification. The MX25L8006E is a flash memory with standard serial interface, which supports standard 1xI/O and dual 2xI/O read,...

 
Wednesday July 21, 2010
ChipEstimate.com Partner Headline

Cadence and ARM Collaborate to Create an ARM-Optimized System Realization Solution

Joint Effort Will Streamline Development Time of ARM Processor-Based Devices

SAN JOSE, CA--(July 21, 2010)- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced a broadening of its existing collaboration with ARM to develop an optimized System Realization solution for ARM processors that will enable...


 
Tuesday July 20, 2010
ChipEstimate.com Partner Headline

Fujitsu Adopts Cadence Chip Planning Technology

Technology Giant Deploys Cadence IC Planning Products to Provide New Design Environment for ASIC Users

SAN JOSE, CA--(July 20, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Fujitsu Semiconductor Ltd. has adopted Cadence chip planning technology for its design teams while...


 
Monday July 19, 2010
ChipEstimate.com Partner Headline

S3 Group and Broadcom Support BSkyB's Set-Top Box Development

DUBLIN-- July 19, 2010 --S3 Group today announced that it has collaborated with Sky on the development of its latest high-definition (HD), low-power set-top boxes (STBs), the DRX890 and the DRX895. These boxes include highly integrated and advanced STB technology from Broadcom Corporation. Both boxes boast enhanced features, increased storage...

 
Friday July 16, 2010
ChipEstimate.com Partner Headline

DOLPHIN Integration and Infolytica Corporation enable mechatronic system simulation using MagNet and MotorSolve coupled with SMASH

July 16, 2010 - Montreal, Qc and Grenoble, Fr - DOLPHIN Integration SA and Infolytica Corporation announce today that their solutions for mixed signal simulation and electromagnetic field simulation can now work together to perform powerful mechatronic system simulation. SMASH, from DOLPHIN Integration, can directly simulate response surface models of...

 
Thursday July 15, 2010
ChipEstimate.com Partner Headline

Cadence QRC Extraction Adopted by STMicroelectronics for 40nm Analog/Mixed-Signal Design

SAN JOSE, CA--(July 15, 2010) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that STMicroelectronics, a global leader in integrated circuits for communications, consumer, computer, automotive and industrial applications, has standardized onCadence QRC Extraction for their 40-nanometer custom/analog designs. A key component...


 
Wednesday July 14, 2010
ChipEstimate.com Partner Headline

ASSET and IPextreme Collaborate to Enable ScanWorks as an IEEE 1149.7 Test Solution

Once Integrated with IPextremes IP, ScanWorks Will Perform IEEE 1149.7 Chip and Board Tests

July 14, 2010 RICHARDSON, Texas - ASSET InterTech, Inc., the leading supplier of tools for embedded instrumentation, will integrate intellectual property (IP) from IPextreme into its ScanWorks platform for embedded instruments to enable chip and circuit board...

 
Tuesday July 13, 2010
ChipEstimate.com Partner Headline

SVTC Technologies Selects Synopsys' Manufacturing Tools to Accelerate Time to Commercialization

Comprehensive Tool Suite Addresses Needs of Innovative CMOS, MEMS and Photovoltaic Technologies

MOUNTAIN VIEW, Calif., July 13 - Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that SVTC Technologies, the leading commercialization service provider for new, emerging silicon-based technologies, has...

 
Monday July 12, 2010
Industry Headline

GSA ANNOUNCES INFRASTRUCTURE TO EASE THIRD-PARTY IP LICENSING PROCESS FOR SEMICONDUCTOR INDUSTRY

SAN JOSE, Calif. (July 12, 2010) GSA, the voice of the global semiconductor industry, today announces its plans to help third-party IP buyers and sellers reduce costs and shorten the IP negotiation cycle with a new IP Licensing Best Practices survey and report.

GSAs IP Interest Group...

 
Friday July 09, 2010
ChipEstimate.com Partner Headline

Dolphin Integration offers a cutting-edge solution for the smooth integration of a precise measurement Converter into a soC

Meylan, France July 9, 2010.

Dolphin Integration extends their pursuit of reactivity for releasing fast and safe custom configurations for High Resolution Analog Front-Ends for Sensors. To this end, they had launched the configurator JAXSENS of a kit of pre-designed mixed-signal blocks. The JAXSENS kit is now enriched with several...


 
Thursday July 08, 2010
ChipEstimate.com Partner Headline

eMemory announces industry's first and only Green High Density OTP solution

Hsinchu, Taiwan (July 07, 2010) eMemory, a world leading NVM IP vendor, today announces the industry's first and only 0.18um/3.3V Green High Density OTP solution as an enthusiastic and immediate response to the semiconductor industry's recent call for green energy and environmental protection. By its supreme device development ability, eMemory...


 
Wednesday July 07, 2010
ChipEstimate.com Partner Headline

Open-Silicon Integrates 50 DesignWare Interface and Analog IP Products with 100 Percent Silicon Success

High-Quality, Fully Verified IP and Longstanding Relationship Between the Two Companies Accelerates Time-to-Market for Open-Silicon's CustomersMOUNTAIN VIEW, Calif., July 7 /PRNewswire-FirstCall/ -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Open-Silicon, a leading system-on-chip (SoC) design and semiconductor...

 
Tuesday July 06, 2010
ChipEstimate.com Partner Headline

Faraday Selects Alvand Technologies AFE (Analog Front End) IP to Support Next Generation Wireless Applications

Santa Clara, Calif. Jul. 6, 2010

Faraday Technology Corporation [TAIEX: 3035], a leading ASIC and silicon IP provider, today announced that it has selected the Analog Front End (AFE) IP in UMC 65nm from Alvand Technologies, Inc., a leading provider of high-performance, ultra low-power mixed-signal IP solutions. The selected AFE...


 
Monday July 05, 2010
Industry Headline

Obsidian Software Offers Microprocessor Verification Scholarship

Obsidian SoftwareMTV Conference - Austin, TX

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Friday July 02, 2010
ChipEstimate.com Partner Headline

DOLPHIN Integration upgrades SLED and SMASH delivering block-busting innovation

Grenoble, France, July 2, 2010. Last week, Dolphin Integration delivered block-busting upgrades of their schematic editor SLED optimized with their multi-domain simulator SMASH.

SLED 1.6 provides the means for logic and analog designers to easily and graphically assemble multi-level and multi-domain designs. Handling the disciplines of pins has been integrated into...

 
Thursday July 01, 2010
ChipEstimate.com Partner Headline

Intelop vs intel; Intelop corporation announces its name change to 'intilop'.

Previously known as intelop corporation, was ordered by a district court in Santa Clara County to change their name because intelop contains the name intel. A name infringement lawsuit was brought on by intel corporation who had been in negotiations with intelop corporation for about 2 years regarding this matter.

Santa...

 
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