April 24, 2007
	Welcome to the first issue of IP Connections, a bi-weekly newsletter designed to provide you with the latest information on semiconductor IP. We hope you find this newsletter helpful for your current or upcoming chip design project. ChipEstimate.com		NVM for HDCP key storage used in HDMI and DVI interfaces from Sidense 32-Bit, 32-bit Code-Optimized Microprocessor from CAST Secure NVM for HDCP Key storage for TSMC 90nm G Process from Kilopass Technology Rambus DDR2 from Rambus ATSC HDTV Demodulator Analog Front End(AFE) from Go2Silicon AES Cryptography (CCM, CBC,GCM, XTS modes) from CebaTech XAP3 32-bit ASIC Processor, XAP RISC from Cambridge Consultants DDR/DDR2 Memory Controller IP from Uniquify AES Core Generation 2 from Algotronix High-throughput XTS-AES Core from Elliptic Fastest AES core, supports all AES key sizes,128-bit internal... from Jetstream 1MK-bit Embedded Non-Volatile Memory IP for TSMC 90nm G... from Kilopass Technology 64 Kbit NVM in 90nm Standard Logic CMOS process OTP/eMTP from Sidense Rambus® Gen2 PHY Cells Designed for PCI Express... from Rambus Payment Card Industry (PCI) Embedded Security Module from Elliptic AES-CCM encryption and authentication in IEEE 802.16e... from Jetstream Serial ATA PHY IP, for 3.0/1.5Gbps from CEVA 12 Bit 160 MSPS Video Triple DAC from Silicon & Software Systems (S3)		Embedded NVM   Your license to speed     The Foundation of Information Security      IP Usage Per Chip   Average chip area allocated to IP passes half way point. • 2005: 48% of chip • 2006: 52% of chip • 2007: 54% of chip * Chip Estimate analysis, 45,000 design estimates   CAST delivers IP that Works - Get proven IP products from the most experienced independent provider. 100 cores including processors, interfaces, image compression, and more, plus SoC Kernels pre-integrating hardware and software for a headstart on system development. more>>   Wolfgang Helfricht, ARM Automated chip estimation gives early insight into advantages of different IP libraries. ARM® and Chip Estimate teamed up to show how designers of complex SoCs for wireless applications can quickly assess different standard cell libraries. Specifically, how different libraries will impact a final chip implementation with respect to die size, power, yield and packaged chip cost. more>>
	ARM1176JZF-S processor core with cache from ARM 2.5 MHz 4.2V Tolerant Step-down DC-DC from ChipIdea DFPAU - Floating Point Arithmetic Unit from Digital Core Design 64 Kbit NVM in 130nm Standard Logic CMOS process OTP/eMTP from Sidense Wide Range Frequency Synthesizer/ Deskew PLL for... from Analog Bits Voltage Regulator from Unive 0.25um 10-bit Video DAC (2.5V/3.3V) from Global Unichip Serial ATA-PHY from LDIC I2C Bus Controller - version 2.1 ( High Speed ) from CAST MystiPHY110 - T13 from Transwitch SD/SDIO/MMC Host IP with CE-ATA support from ASICS World Services Step-Up DCDC from ChipIdea PCI 2.2 Transceiver (UMC 0.18um) from MOSAID QCADC12-18C 40 Mhz 10 Bit Pipeline ADC from QualCore MOSAID Memorize(TM) DDR/DDR2 SDRAM PHY (TSMC... from MOSAID Battery Charger for Lithium Batteries from ChipIdea Serial ATA Device Protocol IP from CEVA
	Semico: Structured ASICs set for future "explosive" growth Analysts at Semico Research say that revenues for the structured ASIC category are set to grow 13 percent in 2007, and could have even stronger growth in coming years. Firms temper 2007 worldwide semiconductor outlooks Citing lingering inventory excesses and slowdowns in the mobile phone and the memory markets, market research firms iSuppli and IC Insights have trimmed their... VC investments hit highest quarterly level in 5 years, report says In the first quarter of 2007, venture capitalists invested $7.1 billion into 778 deals, the highest quarterly dollar amount since the fourth quarter of 2001, according to the... Extending EU regulations with REACH Despite the hassle many electronics companies went through to find alternative substances to replace materials forbidden by the EU RoHS directive, a new challenge... Atmel urges shareholders to vote down Perlegos' corporate shake-up... In the latest bout of sparring between Atmel and its former CEO George Perlegos, the company is urging its shareholders to vote against Perlegos' campaign to restructure... Cadence debuts 65-nm reference flow targeting Common Platform EDA giant Cadence Design Systems has announced the immediate availability of a 65-nm RTL-to-GDSII reference flow targeted at Common Platform technology. Q1 MPU market share wrap-up: Intel grew stronger as AMD faltered Analysts at iSuppli said that Intel gained 4.5 percentage points in the global microprocessor market during Q1; meanwhile, its rival chipmaker AMD's share fell... Avnet Electronics Marketing appoints new China regional prez Avnet Electronics Marketing Asia, a distributor of electronic components and a division of Avnet Inc., has appointed Peter Wong as regional president of Avnet China. House subcommittee approves bill to double funding for NIST programs The U.S. House of Representatives' subcommittee on technology and innovation has approved a bill that ups funding for the National Institute of Standards and Technology. Multicore programming tool startup garners $10M in VC funding RapidMind says it will used the funding to ramp up development, sales and marketing in the GPU and Cell BE market space and accelerate support for multicore CPU... iSuppli: Q1 mobile phone shipments fall, Samsung exception Global mobile phone shipments fell by 12.8 percent sequentially, a seasonally weak drop from Q4's peak buying season, iSuppli said, noting that Samsung, however,...
	Kilopass XPM (eXtra Permanent Memory) sets the standard for high reliability, high density, low cost, and ease of implementation for embedded non-volatile memory IP in standard logic CMOS SOC design applications. Kilopass offers SOC designers a one-stop solution for embedded NVM applications between .18um and 90nm today, and 65nm in the near future. more>>
	UPDATE PROFILE  |  FEEDBACK  |  PASS IT ON  |  REGISTER  |  TERMS OF USE Copyright © 2007 ChipEstimate.com. All rights reserved.