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Common Theme Amongst Jama, ARM Techcon and TSMC OIP Events
Three very different conferences from Jama, ARM and TSMC highlight the breadth and depth of IP development in the semiconductor and IoT spaces.
By John Blyler, Editor
In the October issue of the “High-Tech Traveler Log,” Sean O’Kane and I talk about three recent major events in Silicon Valley and how they were related. The events included Jama’s Software Product Delivery Summit, TSMC’s Open Innovation Platform (OIP) and ARM’s Techcon. While each event was markedly different there was an unintentional common thread, i.e., all three dealt with the interplay between hardware and software IP systems – albeit on different levels of the supply chain.
See the Chipestimate.tv Youtube video.
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View all posts by John Blyler