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Cadence Tensilica Vision P-Series DSPs are Industry's First Imaging/Vision DSPs Certified by Khronos as OpenVX 1.1 Conformant
April 20, 2017
Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP
January 05, 2017
Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
January 05, 2017
Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology
January 04, 2017
Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
January 04, 2017
Cadence to Showcase Latest Tensilica DSPs for Mobile, Automotive, IoT and Consumer Applications at CES 2017
December 15, 2016
Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch
December 15, 2016
Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP
January 28, 2015
Latest Tensilica Processors Deliver Up to 75% Memory Power and Area Savings
January 12, 2015
MStar licenses Tensilica IP Core from Cadence
August 04, 2013
ComplexIQ Partners With Tensilica for Multimedia over Coax Network Interface
April 16, 2013
Algotochip Becomes Tensilica Design Center Partner
March 25, 2013
Tensilica Joins HSA Foundation to Help Establish Standards for Embedded Heterogeneous Computing
March 19, 2013
Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
February 25, 2013
Tensilica and Sensory Drive Industry's Lowest Power DSP-Based Voice Activation Solution
February 25, 2013
Tensilica to Demonstrate Fujitsu Smartphone That Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona
February 20, 2013
Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs
February 19, 2013
New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
February 19, 2013
Bwave and Ubiso to Demonstrate World's First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica's ConnX BBE16 DSP
February 15, 2013
Tensilica and Acoustic Technologies Extend Partnership to Deliver Complete Wideband HD Voice Processing Solution for Smartphones, Tablets and Other Mobile Computing Devices
February 13, 2013
Phison Licenses Tensilica's Dataplane Processor for NAND Flash Memory Controllers and SSD Applications
February 05, 2013
TU Dresden Realized 28nm Low-Power Test Chip With Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
February 04, 2013
Waves MaxxAudio Sound-Enhancement Technology Is Now Available for Tensilica HiFi Audio DSP Cores at CES
January 07, 2013
Tensilica Introduces the Smallest, Lowest Power DSP IP Core for Always-Listening Voice Trigger and Voice Recognition
January 03, 2013
Tensilica to Feature Customer Innovations in Smartphones and Home Entertainment at CES 2013
December 18, 2012
Tensilica Hits Major Milestone: 200 Licensees for Dataplane Processor IP Cores
December 04, 2012
Tensilica and mimoOn Partner to Provide the Only Comprehensive LTE and LTE-Advanced Hardware-Software PHY IP Solution
November 27, 2012
IntegrIT's Wideband Acoustic Echo Canceller Now Available on Tensilica's HiFi Audio/Voice DSP
October 16, 2012
Tensilica Licensees Ship Two Billion IP Cores; License Revenue Now Larger Than Any Other DSP Licensing Company
October 10, 2012
Hisense Picks Tensilica's HiFi Audio/Voice DSP and Software Codecs for DTVs
October 09, 2012
MegaChips Selects Tensilica's HiFi Audio/Voice DSP for Consumer Products Designs
October 03, 2012
Renesas Electronics Announces the RL78/D1A Group of Single-Chip Microcontrollers for Automotive Instrument Clusters; Industry’s Smallest MCUs for Two-Wheeled Vehicles
October 02, 2012
Tensilica Reaches Audio/Voice DSP Milestone: Most Widely Licensed Audio Architecture for SOC Design
September 11, 2012
Optimized Port of micro-T-Kernel RTOS Now Available for Tensilica's DPUs
September 04, 2012
Tensilica HiFi Audio/Voice DSP Licensed to Renesas Electronics
August 28, 2012
Novatek in Volume Production With Three New Home Entertainment SOCs Using Tensilica HiFi Audio DSP
August 14, 2012
Inband Software Offers DSP Development Services for Tensilica Customers
August 07, 2012
Tensilica Joins Wi-Fi Alliance to Provide Wireless Multi-Standard Modem Solutions
July 30, 2012
Toshiba Introduces New High Gain, High Power X-Band GaN Hybrid IC
June 20, 2012
DSP Shipments Doubled by Tensilica, Ranks Second in DSP IP Market According to The Linley Group
June 20, 2012
New Reference Designs Enhance Embedded Function Block of Lattice MachXO2 PLD Family
June 04, 2012
Tensilica Discusses IP Core Technology on Multiple Panels at DAC 2012
June 04, 2012
CEVA Continues to Dominate DSP IP Market with 90% Market Share
May 14, 2012
The Importance of Customizable IP Subsystems to be Discussed by Tensilica at Semico IMPACT Conference
May 14, 2012
System and Software Development Accelerated with Virtual Prototyping Platforms from Tensilica and VWorks
May 08, 2012
Registration Opens for Annual Atmel Technology Live Developer Conference
April 23, 2012
Tensilica Doubles Size of Dataplane Processor R&D Center in Pune, India
April 23, 2012
Audio DSP Milestones Reached by Tensilica: 300 Million HiFi Audio/Voice DSPs, Over 100 Software Packages, More Than 30 Partners
April 23, 2012
Dynamic Resolution Adaptation Audio Standard Added to HiFi Audio DSP Library by Tensilica
April 23, 2012
Tensilica Promotes Hiroyuki Uchimura to Managing Director of Japan Office
April 18, 2012
ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing is Licensed by Tensilica to Renesas Electronics
April 17, 2012
Tensilica CTO and Founder Chris Rowen Presents on LTE-Advanced Handsets at Linley Tech Mobile Conference
April 05, 2012
ClariPhy Licenses Tensilica's Xtensa Dataplane Processor (DPU) for Optical Networking Mixed Signal, Digital Signal Processing (MXSP) SOCs
March 01, 2012
Tensilica HiFi Audio DSP Supports Dolby Digital Plus for Surround Sound on Mobile Devices
February 27, 2012
Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC From NTT DOCOMO, Fujitsu, NEC and Panasonic Consortium
February 27, 2012
Arkamys Audio Enhancement Software and Services Being Ported to Tensilica's HiFi Audio DSPs
February 24, 2012
Sensory and Tensilica Partner to Offer Complete Speech Recognition Subsystem
February 23, 2012
Tensilica's Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012
February 22, 2012
Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less Than 200mW
February 21, 2012
VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design
February 15, 2012
mimoOn and Tensilica Offer Complete LTE PHY Reference Platform for User Equipment and eNodeB PHY at Mobile World Congress 2012
February 14, 2012
Acoustic Technologies Noise Reduction and Echo Cancellation Software Now Available on Maxim's MAX98095 Based on Tensilica's HiFi Audio/Voice DSPs
February 13, 2012
Shanghai HDIC Picks Tensilica's HiFi Audio DSP for Digital Television System-on-Chip
January 24, 2012
Tensilica's ConnX Baseband Engine DSP Core Successfully Deployed by NXP Semiconductors
January 16, 2012
Tensilica's HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment
January 09, 2012
Tensilica HiFi Audio DSP Supports Dolby Volume to Eliminate Volume Fluctuations in Home Entertainment Systems and DTVs
January 05, 2012
Tensilica Showcases Latest Customer Innovations in Smartphones, DTV, and Other Consumer Electronics Equipment at CES 2012
January 04, 2012
Software Porting to Tensilica-Based Multicore SOC Designs Now Aided by PolyCore Software's Poly-Platform(TM)
December 22, 2011
Tensilica Signs RacyICs as New Authorized Design Center Partner for IC Design
November 28, 2011
Skyviia Chooses Tensilica's HiFi Audio DSP
November 15, 2011
Tensilica Hosts Live Seminar in Israel to Discuss "Customizable DSP IP Cores Made Simple"
November 14, 2011
EnVerv Selects Tensilica for Smart Grid Power Line Communications
October 25, 2011
IntegrIT's DSP Math Library Now Available for Tensilica's Baseband DSPs
October 11, 2011
Tensilica CTO and Founder Chris Rowen Presents on the World's Fastest DSP Core at HOT CHIPS 23
August 17, 2011
Tensilica CTO and Founder Chris Rowen Presents on the World's Fastest DSP Core at HOT CHIPS 23
August 17, 2011
LG Electronics Picks Tensilica's HiFi Audio DSP and SW Codecs for HDTV
August 02, 2011
Dream Chip Technology Becomes Tensilica System-on-Chip (SOC) Design Center Partner
July 12, 2011
Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012
June 08, 2011
Tensilica CTO and Founder Chris Rowen Presents at IEEE Computer Society of Silicon Valley
May 10, 2011
Tensilica First IP DSP Core Supplier to Offer DTS Broadcast and DTS DMP Support
April 26, 2011
Tensilica Presenting on Voice and Audio Requirements for Smartphones at Inaugural Linley Tech Mobile Conference
April 12, 2011
New Tensilica IP Core Targeted to Dataplane and Signal Processing Functions Such as Imaging, Communications and Networking, Boost Data Bandwidth 4X
March 28, 2011
Tensilica CTO and Founder Chris Rowen to Announce New Technology and Join Panel at Globalpress Electronics Summit 2011
March 24, 2011
mimoOn and Tensilica Demonstrate Atlas LTE Platform for Mobile SDR Baseband at MWC 2011
February 09, 2011
Tensilica Showcases #1 Position in 4G LTE Baseband DSP IP Cores at MWC 2011
February 07, 2011
Tensilica Announces ConnX BBE64-128 -- the World's Highest Performance DSP IP Core for LTE Advanced
February 07, 2011
Tensilica Showcases #1 Position in 4G LTE Baseband DSP IP Cores at MWC 2011
February 07, 2011
Tensilica Announces Availability of Atlas Reference Architecture Dataplane Processors for a Complete Baseband PHY for LTE, HSPA+ and WiMAX
February 07, 2011
Tensilica Announces ConnX BBE64-128 -- the World's Highest Performance DSP IP Core for LTE Advanced
February 07, 2011
HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
February 03, 2011
Fujitsu Signs Multi-Year Corporate License for Tensilica's Audio, Baseband DSP and Dataplane Processor IP Cores
January 31, 2011
Tensilica's Dominant Market Share in Audio DSP IP Cores in Evidence at CES 2011 in Las Vegas
January 05, 2011
Tensilica's HiFi Audio DSP First IP Core to Support SRS' Advanced StudioSound HD Audio Suite for HDTVs
December 21, 2010
IntegrIT's Math Library Now Available for Tensilica's HiFi Audio DSPs
December 07, 2010
Tensilica CTO Chris Rowen Speaker and Panelist at SDR'10
November 30, 2010
Tensilica CTO Chris Rowen Speaker and Panelist at SDR'10
November 30, 2010
DesignArt Networks Relies on Tensilica for 4G SoC Family
October 19, 2010
4M Wireless Completes LTE Protocol Stack Software Port for Tensilica's 3GPP LTE Reference Architecture
October 06, 2010
Tensilica Inc. Announces Strategic Investment by Fujitsu
September 29, 2010
Tensilica, Inc. Announces Strategic Investment by Fujitsu
September 21, 2010
AppliedMicro Picks Tensilica's Dataplane Processors for High-Throughput Communications Chip Design
September 14, 2010
KPIT Cummins Becomes Authorized Tensilica System-on-Chip (SoC) Design Center
August 17, 2010
Novatek Selects Tensilica's HiFi Audio DSP for Blu-ray Disc and DTV
August 11, 2010
SySDSoft Ports Complete LTE Protocol Stack to Tensilica's Atlas LTE Reference Architecture
July 28, 2010
Chelsio Communications Licenses Tensilica's Xtensa LX Customizable Dataplane Processor Core for 10 Gigabit Ethernet
July 20, 2010
Tensilica Adds FLAC Decoder to HiFi Audio Codec Library
June 30, 2010
Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS10 Multistream Decoder
June 23, 2010
Express Logic ThreadX Available for Tensilica's New Third-Generation Diamond Standard Dataplane Processor Cores
April 14, 2010
Tensilica CTO Chris Rowen Special Session Speaker at COOL Chips XIII International Symposium
April 08, 2010
IntegrIT Joins Tensilica's Xtensions Partner Network for DSP Software Services
March 24, 2010
Multiple Tensilica IP Cores Power NEC, Fujitsu and Panasonic Mobile Communications Fully Functional LTE Handset SOC for Major Japanese Wireless Carrier
March 22, 2010
Tensilica CTO Chris Rowen Selected as Speaker at Anniversary Meeting of Santa Clara Valley's Solid State Circuits Society
March 16, 2010
Tensilica Introduces Third Generation Diamond Standard Controllers Optimized for Low Power, High Performance Applications
March 15, 2010
Tensilica CTO Chris Rowen Selected for Multiple Presentations at DATE Conference
March 04, 2010
Tensilica and mimoOn Partner for LTE Baseband Handset Solutions
February 10, 2010
Tensilica Introduces ConnX Atlas Reference Architecture for LTE
February 08, 2010
Tensilica Introduces Second Generation ConnX BaseBand Engine DSP for Demanding Algorithms for LTE/4G Wireless Handsets and Base Stations
February 08, 2010
Tensilica Introduces HiFi EP DSP Core for High Quality Audio in Home Entertainment and Smartphone Applications
February 01, 2010
Tensilica Demonstrates Success in Audio/Video and Broadband Communications at CES 2010
January 05, 2010
Tensilica's ConnX D2 DSP Engine Wins EDN Top 100 Electronic Products Award for 2009
December 21, 2009
Tensilica Delivers New Design Flow Support for Synopsys' Galaxy Implementation Platform Technologies
December 08, 2009
Tensilica Announces Enhanced Tools for Dataplane Processor Design and Software Development
December 07, 2009
Tensilica Announces Enhanced Tools for Dataplane Processor Design and Software Development
December 07, 2009
Samsung Signs Multi-Year License for Tensilica's HiFi 2 Audio DSP
November 19, 2009
New Tensilica DPU Family Delivers 10 GigaMAC/sec DSP Performance, Tops 1 GHz Mark
November 02, 2009
Tensilica Introduces Small, Ultra-Low Power Dataplane Processor Core for Deeply Embedded Control
October 19, 2009
Tata Elxsi and Tensilica Announce RoS-ES RTOS for Diamond Standard and Xtensa Customizable DPUs
October 15, 2009
Tensilica's HiFi Audio DSP First IP Core to Achieve DTS-HD Master Audio Logo Certification
October 13, 2009
Micrium Offers Expanded Support for uC/OS-II RTOS for Entire Tensilica Dataplane Processor Line
September 16, 2009
Tensilica Chief Scientist Joins Panel Discussion at EE Times Virtual Conference: System-on-Chip, Designing Next Generation SOCs
September 14, 2009
Tensilica CTO Discussing "Development Tools for 4G Hardware and Software" at 4G Wireless and Evolution Conference
September 01, 2009
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