Lee has a wealth of experience within the semiconductor industry across sales, business development, and engineering roles. During his 15 years at Tensilica (acquired by Cadence in 2013) he worked most recently as Global IP Sales Manager where he managed all processor IP activity at Intel, and previously as Director of Strategic Planning and Director of WW Field Applications Engineering among other roles. He has also served at Intel as a strategic planner responsible for long -term roadmaps for all PC CPUs and chipsets, and in engineering and architecture roles at Compaq, TI, and the Dept. of Defense. Lee has a BSEE from the University of Texas.