Industry Trends

Rambus Design Summit is on July 19th! A virtual conference focused on the selection and implementation of chip & IP solutions for the data center, edge, automotive, and IoT devices including the acceleration and security of AI/ML applications.
Register Now!

Join designers, researchers, tool developers & vendors for superb training, education, exhibits & networking at the event for the design & design automation of electronic chips to systems. DAC topics include IP, AI, EDA, Security, Cloud & Embedded Systems.
Register Today

* High performance PHY with optional controller
* Delivered as hard macro with I/Os to exact customer floorplan
* Easy to close timing, integrate and test
* Available in variety of protocols and TSMC processes
 

Join our webinar to learn how to use an initial SiP file from the Cadence^® Allegro^® Package Designer to enable IC-package co-design in the Cadence Virtuoso^® platform and keep the SiP database and OpenAccess database in sync in the Virtuoso platform.
Register now

Join our webinar to discover the challenges of PCB designs today and learn more about thermal only versus dynamic IR drop analysis.
Register now

Join CadenceLIVE Silicon Valley on June 8-9 for over 80 exciting and dynamic sessions across 11 tracks. Hear top technologists from companies such as Microsoft, NVIDIA, BAE Systems, Meta, Samsung, Renesas, Broadcom, Texas Instruments, and more. Learn new ways to solve your design challenges.
Register for CadenceLIVE Silicon Valley

Join this webinar to learn how a full Cadence® design and analysis flow can reduce your time to signoff for PCIe 6.0 devices by up to two months. It will present solutions for the signal integrity (SI) and power integrity (PI) challenges associated with the new PCIe 6.0 standard, along with early what-if analysis scenarios using system-level exploration technology that guides design teams toward optimized solutions. 
Register Now

Come talk to our Cadence Tensilica® experts at Autosens Detroit & find out how our IP solutions & On-Device AI enable the automotive of the future. 
Attend Cadence Presentation: 
What sensing & On-Device AI are required for the automotive of the future?
Register Now

Join us for this webinar where Thierry Kouthon of Rambus and Ann Keffer of Siemens will discuss hardware solutions for securing automotive electronics and how functional safety tools from Siemens meet the requirements of ISO 26262.
Register Now

Learn best practices for proper EM analysis to quickly achieve accurate simulation results. Review CAD techniques for leveraging EM simulation to more rapidly analyze and optimize designs versus sheer brute force of large numbers for distinct EM simulations.
Register Now